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Wafer debonding cleaning machine

◆ Suitable for cleaning operations in the debonding process after etching 6-inch, 8-inch, or 12 inch wafers.

Work rhythm: 20-30 minutes.

Configure 11 sets of cleaning and drying chambers

Reliable specialized liquid fast discharge device ensures efficient process switching.

◆ Built in combination tooling automatic conveying device, ensuring composite process requirements and high precision

Production efficiency.

4 sets of independent control devices for cleaning solution.

Chemical liquid recovery and storage device.

◆ Precise control system for medication flow rate.

N2 warm air drying system.

Efficient air purification and intake and exhaust devices.

Excellent cleaning effect.

◆ Automatic fire extinguishing device.

Product Description